3015 Effects of Cu Interlayer on Adhesive Strength of DLC Thin Films
Details
In this research, we formed DLC films with copper interlayer by DC magnetron sputtering method. To improve the adhesive strength of the films to steel substrate, Cu contents were varied gradually to from the mixing layer around the interface between Cu and DLC. DLC films were peeled off from SUJ2 substrate just after the deposition. On the other hand, DLC films with the interlayer or the mixing layer were succeeded to prepare on SUJ2 substrate at 100℃. Furthermore, Rockwell indentation study showed that the adhesive strength of the DLC films with the mixing layer was higher than that of the DLC films with the interlayer. Therefore, to form the mixing layer is thought to be effective for improving the adhesion of the DLC films. However, the adhesive strength decreased with increasing the substrate temperature even on the DLC films with the mixing layer. This is mainly due to the differences of thermal conductivity and thermal expansion coefficient between Cu and C in the DLC films.
