3553 Effect of a Void Position on Fatigue Life for BGA Solder Joints
Keywords:
Life Prediction,
Crack Propagation,
Finite Element Method,
Solder joint,
Void,
Ball Grid Array
Details
The fatigue life of solder joints can be reduced by voids in the joint. We developed a new crack propagation model for detecting crack propagation in the solder joints. In our model, the fatigue life of a solder joint is estimated based on the amount of damage that accumulates during crack propagation, and the crack paths are automatically calculated. We analyzed the effect of varying the void position on the crack paths and the fatigue life of a ball grid array (BGA) solder joint, which was connected with a solder-mask defined (SMD) pad and a non-solder-mask defined (NSMD) pad. The calculations revealed that a void adjacent to the SMD pad decreased the fatigue life and that a void adjacent to the NSMD pad increased the fatigue life. The crack paths and fatigue lives were found to strongly depend on void position.
