4324 Influence of Temperature and Strain on Phase Growth Process in Sn-3.0Ag-0.5Cu Solder Joints

Abstract

This paper describes phase growth of Sn-3.0Ag-0.5Cu solder joints by mechanical cyclic loading. Lap joint type shear specimens were used to evaluate the influence of temperature and strain on the phase growth process of solder joints. The mechanical cyclic loading was carried out under constant temperature condition. The phase growth processes of β-Sn phase in the solder joint were observed by the scanning electron microscope (SEM). Consequently, various phase growth processes were observed under different strain rate conditions.