3609 マイクロハードディスク用超精密フラット・チャンファリングシステムの研究開発(G13 生産加工・工作機械,G13 生産加工・工作機械)

渡邉 裕; 上原 嘉宏; 林 偉民; 水谷 正義; 片平 和俊; 加藤 照子; 郭 建強; 大森 整; 田島 琢二; 岡本 友孝; 大野 修平; 仁平 正三

doi:10.1299/jsmemecjo.2007.4.0_283

2007.4

Session ID : 3609

DOI https://doi.org/10.1299/jsmemecjo.2007.4.0_283

Conference information

3609 R & D of Ultra Precision Flat/Chamfer Machining System for Micro Hard Disk

Yutaka WATANABE, Yoshihiro UEHARA, Weimin LIN, Masayoshi MIZUTANI, Toshikazu KATAHIRA, Teruko KATO, Jianqiang GUO, Hitoshi OHMORI, Takuji TAJIMA, Tomoyuki OKAMOTO, Shuhei OHNO, Shozo NIHIRA

Author information

Yutaka WATANABE
RIKEN (The Institute of Physical and Chemical Research)
Yoshihiro UEHARA
RIKEN (The Institute of Physical and Chemical Research)
Weimin LIN
RIKEN (The Institute of Physical and Chemical Research)
Masayoshi MIZUTANI
RIKEN (The Institute of Physical and Chemical Research)
Toshikazu KATAHIRA
RIKEN (The Institute of Physical and Chemical Research)
Teruko KATO
RIKEN (The Institute of Physical and Chemical Research)
Jianqiang GUO
RIKEN (The Institute of Physical and Chemical Research)
Hitoshi OHMORI
RIKEN (The Institute of Physical and Chemical Research)
Takuji TAJIMA
Maruto Instrument Co., LTD
Tomoyuki OKAMOTO
Maruto Instrument Co., LTD
Shuhei OHNO
Maruto Instrument Co., LTD
Shozo NIHIRA
Maruto Instrument Co., LTD

Keywords: Micro hard disk, glass disk, flat, chamfer machining, ELID grinding, ultra precision, surface roughness

CONFERENCE PROCEEDINGS RESTRICTED ACCESS

Details

Abstract

Recently, a demand for micro hard disk is on the increase. Along with it, it is necessary to machine micro hard disk with smoother surface (ultra precision flat) and sharper edge (ultra precision chamfer). In this research, we developed the ultra precision flat/chamfer machining system for micro hard disk, and we investigated a characteristic of this machining system. This machining system has control part, mirror surface grinding part with ELID unit, processing arm part and standby part for glass hard disk. As a result using this machining system, when a SD#8,000 wheel and #8,000 particles of CeO_2 were used, finished roughness was Ra 5.2nm and 2.8nm.

Corresponding author

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