A coupling analysis method has been developed for analyzing temperature distribution on electric devices by combining the structural stress analysis with electric-thermal conductivity analysis. Estimating the temperature distribution on electric devices is difficult because it is affected by the resistance on the interface, which depends on the magnitude of the contact pressure between structures. In previous approaches to solving this problem, the resistance was considered uniform, whereas the approach used in this method considers it distributed. The method comprises two calculations: the first uses only structural analysis to estimate the contact pressure, which determines the interface resistance and the second uses the electric-thermal conductivity to estimate the temperature distribution. The test results showed that the method works well in designing the shape of an electrode for a vacuum interrupter, which cuts off an electric current.