1928 Evaluation of Thermal Fatigue Micro-crack Propagation Process in Flip Chip Interconnects by Synchrotron Radiation X-ray Micro-tomography

Abstract

A synchrotron radiation X-ray micro-tomography system called SP-μCT with a spatial resolution of about 1μm has been developed in SPring-8. SP-μCT was applied to the nondestructive observation of fatigue crack propagation in solder micro-bumps of flip chip interconnects due to thermal cyclic loading. Additionally, refraction-contrast imaging technique was used to visualize the fatigue cracks, and the crack propagation was evaluated quantitatively. The results show the possibility that nondestructive testing by the micro CT system is useful for the evaluation of the thermal fatigue lifetime in micro-joints.