Abstract
In this paper, the concept and experimental results of Microwave-powered silicon microsensors for distributed and embedded sensing applications are presented. This is the first report of a microsensor device integrated with RF-DC power converter on the same chip. The integrated sensors are fabricated by silicon-MEMS technology. This time, 'fuse-type strain detector' was fabricated by silicon micromachining. Driving power of the integrated microsensors is provided as a remote RF-electromagnetic wave at 1.29GHz and received at the rectenna circuit on the microsensor. In the fabrication step, high-performance Surface Mount Devices (SMD) are integrated on the silicon microchip to realize the highest power efficiency. Mount holes of SMDs were formed by Deep-RIE of silicon with MEMS sensor structures without any additional process steps. Fabricated rectenna and sensors are successfully evaluated with LED mounted for signal output.
