Abstract
The electro deposits of Zn, Cu, and Ni were generated on the copper substrate of the cantilever beam, and the internal stress was measured in-situ by using the TV holographic interferometry which can capture holographic images at TV frame rates. Moreover, the surface and cross section of the deposition were observed by using SEM and TEM. As a result, the large variation of internal stress was caused in the initial stage in which the plating grains with a thin film deposit.
