Abstract
Copper base have been used for many semiconductor package to satisfy thermal radiation performance. However, copper base easily curvature deformed and deformation increases during thermal cycle. In this research, the increase mechanism of copper base deformation during heat cycle is clarified using experimental approach and fmite element analyses. As a result, this phenomenon occurs as a interaction with plastic deformation of copper base at low temperature and a stress relaxation due to solder creep at high temperature. The results of fmite element analysis that considers plasticity of copper and creep deformation of solder joint agree well with experimental result under same thermal cyclic conditions.
