1113 Viscoelastic Deflection Analysis of Printed Circuit Board using Multilayered Plate Theory

Abstract

In this paper, deflection of a multilayered viscoelastic plate subject to thermal load is analyzed using plate theory for estimation of deflection of printed circuit board. Curvature in multilayerd plate and membrane forces in each layer are obtained using the condition of strain at adhesive faces, balancing of membrane forces and bending moments at each layer. The results calculated by proposed technique are compared with the FEM solution, and a good agreement was obtained.