1115 Structural Strength and Thermal Manegment Cooperative Design for Power Device Package
Details
The present trend of power device packages indicates that there is strong customer demand for utilization of several driving circuits and compact packaging with sufficiently high reliability. The mechanical reliability is highly dependent on mechanical packaging technology, which includes cooling techniques and material strength characteristics. The use of cooling systems for a power device package is not only to keep the device temperature below a critical value, but also to control the solder strain caused by thermal expansion. In the present study, the design of a power device package that had a robust thermal property against the manufacturing error was completed. The material selection and the component dimension of the package were determined by examining the solder strain as the result of the thermal expansion difference, the thermal resistance and the variance of these design objects.
