Abstract
As heat generation increases in CPUs and other small electronic devices, more miniaturized and efficient cooling technology has been required. In this study the authors investigated combination of impinging flow and boiling heat transfer in mini channels. By employing aluminum miniature multi-channels in practical use, the authors performed experiments and compared the heat transfer between normal parallel flow mode and impinging flow mode. Impinging flow was realized by making T-junction structure with the aluminum channel. It was found from the experimental results that the impinging flow of T-junction gave higher cooling ability and lower thermal resistance.
