J0103-5-1 CFD simulation of flow soldering process : Case of vertical lifting

Abstract

Flow soldering process is one of major soldering process used in the manufacture of electronics. One of the defects in soldering is a bridge, which connects adjacent components and results in a short circuit fault. It is necessary to clarify the conditions under which the bridge occurs. Flow soldering process with a simple model has been studied experimentally and numerically. The purpose of this study is to clarify the relation between the lifting velocity and the solder volume on the joint. As a result, simulation was able to reproduce a tendency similar to experiment on the relation between the lifting velocity and the solder volume.