Abstract
This paper focuses on evaluating the adhesive strength of Ag-Sn solder-jointed single-crystal silicon (SCS) micro specimens. The exothermic reaction in Al/Ni multilayer film was used as a heat source for melting the solder film. The reaction could generate heat enough to melt Ag-Sn film. To measure the adhesive strength of solder-jointed SCS specimens, we developed the four-point bending tester for minute specimens. The rectangular-solid SCS specimens having a Ag-Sn/AlNi/Ag-Sn multilayered section were prepared by dicing the bonded SCS wafer under various pressure loads in air and vacuum. As a result, fracture strength increased with an increase of pressure load. The strength of specimens bonded in vacuum was higher than that bonded in air.
