The Reference Collection of Annual Meeting
Online ISSN : 2433-1333
VII.01.1
Session ID : W05-(6)
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W05-(6) Application of Computer Aided Engineering for Structural and Reliability Design of Electronic Packaging
Hideo MIURA
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Keywords: Finite Element Method, Structural Analysis, Heat Conduction, Expert System, LSI Package, Reliability
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© 2001 The Japan Society of Mechanical Engineers
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