The Proceedings of the Materials and Mechanics Conference
Online ISSN : 2424-2845
2007
Session ID : 527
Conference information
527 Temperature Dependence of Delamination Strength of Ceramic/Resin adhesive Bonded Joints
Kazutaka MAEDAShoichi NAKAGAWA
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Abstract
Thermal residual stresses of ceramic and resin adhesive bonded joint were calculated using the finite element analyses, considering viscoelasticity characteristics of the adhesive material. The shear debonding tests were carried out at various temperatures, and the stress distributions in adhesion interface were calculated. From the stress distributions at the corner of adhesion interface, two stress singularity parameters H and λ were calculated. The delamination strength Hc was described by functions of λ using Hattori's method. The H and λ values estimated by 3-points bending tests agreed well with the formularized delamination strength Hc. We have confirmed that initiation of the interfacial delamination was well predicted by formularized delamination criteria diagram.
Content from these authors
© 2007 The Japan Society of Mechanical Engineers
Previous article Next article
feedback
Top