The Proceedings of the Materials and Mechanics Conference
Online ISSN : 2424-2845
2007
Session ID : 529
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529 Reliability Evaluation for Solder Joints in Embed Electronic Packages
Masashi YAMABE, Qiang YU, Tadahiro SHIBUTANI, Hiroki MIYAUCHI, Masaki SHIRATORI, Hideki OHHASHI
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Keywords: Embed Electronic Packaging, Reliability
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© 2007 The Japan Society of Mechanical Engineers
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Proceedings of the 1992 Annual Meeting of JSME/MMD

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