The Proceedings of the Materials and Mechanics Conference
Online ISSN : 2424-2845
2008
Session ID : OS0620
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OS0620 Effect of grain boundary characteristics on fatigue strength properties of electroplated copper thin films
Naokazu MURATA, Kinji TAMAKAWA, Ken SUZUKI, Hideo MIURA
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Keywords: Experimental Mechanics, Fatigue Strength, Thin Film, Electroplated Copper, Fracture Surface
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[in Japanese]
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© 2008 The Japan Society of Mechanical Engineers
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Proceedings of the 1992 Annual Meeting of JSME/MMD

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