The Proceedings of the Materials and Mechanics Conference
Online ISSN : 2424-2845
2008
Session ID : OS0710
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OS0710 Experimental Study of Crack Propagation for Sn-3.0Ag-0.5Cu Solder in LCF
Buxiang Zhang, Shengde Zhang, Masao Sakane, Kaoru Kobayashi
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Keywords: Solder, Crack propagation, Low cycle fatigue, Stress intensity factor, Cyclic J-integral, Creep J-integral
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[in Japanese]
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© 2008 The Japan Society of Mechanical Engineers
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Proceedings of the 1992 Annual Meeting of JSME/MMD

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