Abstract
This paper investigates the theimoelectromechanical interaction among multi parallel cracks in a piezoelectric material under a uniform heat flow and a uniform mechanical load far away from the crack region The crack faces are supposed to be insulated thermally and electrically. By using the Fourier transform, the thermal and electromechanical problems are reduced to systems of singular integral equations, respectively. The singular integral equations are solved numerically by using the Gauss-Jacobi integration formula. Numerical calculations are carried out, and detailed results are presented to illustrate the influence of the thermoelectromechanical interaction on the stress and electric displacement intensity factors. The temperature-stress distributions are also presented. From numerical results, we can find that the normalized stress and electric displacement intensity factors are under the great influence of the crack spacing and the number of cracks. Especially, the influence of the thermoelectromechanical interaction on the fracture behavior is complicated when the crack spacing becomes small.
