The Proceedings of the Materials and Mechanics Conference
Online ISSN : 2424-2845
2011
Session ID : OS0102
Conference information
OS0102 Measurement of Displacement and Strain Fields near Interface of Bonded Structure Based on Digital Image Correlation Method Using Surface Configuration Data
T. KURAHASHIK. YamadaH. KOGUCHI
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
We present the digital image correlation method (DICM) using the surface configuration data by the scanning probe microscope (SPM). The bending test is carried out on the table of the scanning probe microscope, and surface configuration data obtained by the SPM is employed in computation of displacement field by the DICM. In addition, after the computation of the displacement field, the moving least square method is applied to compute the strain field.
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© 2011 The Japan Society of Mechanical Engineers
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