Abstract
Both mechanical and electronic properties of electroplated copper films used for interconnections were investigated experimentally considering the change of their micro texture caused by heat treatment. Both the mechanical and electrical properties of electroplated copper thin films were found to vary drastically depending on their micro texture. The quality of the grain boundaries can be evaluated by applying an EBSD (Electron Back Scatter Diffraction) analysis. New two experimentally determined parameters are proposed for evaluating the quality of grain boundaries quantitatively. It was confirmed that the crystallographic quality of grain boundaries can be evaluated quantitatively by using the two parameters, and it is possible to estimate both the strength and reliability of the interconnections.
