Abstract
Numerical methods like the fmite element method (FEM) have been used to evaluate the reliability of electronic packages. However, it is difficult to assure the accuracy of numerical analyses of electronic packages, which are nonlinear analyses. In this study, we evaluated the thermal strain of a test chip for 3D (Stacked Integrated Circuits) SIC with both measurement and analyses. First, the distribution of thermal strain on the cross-section of the test chip was measured using the digital image correlation method (DICM). Then, the distribution of strain in the test chip was also analyzed by the FEM with considering the visco-elasticity of underfill resin and the elastic-plasticity of components measured with the nano-indentation. According to the comparison between the DIC measurements and the FEM analyses, we improved the accuracy of the nonlinear fmite element analyses.
