OS1902 Local adhesion strength of multi-grain Cu / insulation layer interface in sub-micron copper damascene wiring systems

Abstract

For a brick-shape specimen with grain-scale dimensions on a damascene wiring, a fracture test was performed by a nanoindenter inside the SEM to evaluate the adhesion strength of the interface Cu/SiN. The copper grain distribution on the specimen footprint was observed by EBSD analysis. The correlation of the adhesion strength and multi-grain structure in the specimen footprint was evaluated. As the result, it was found that adhesion strength was significantly affected by the copper multi-grain structure.