The Proceedings of the Materials and Mechanics Conference
Online ISSN : 2424-2845
2013
Session ID : OS0919
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OS0919 Electroplating Temperature Dependence of Recrystallization of Copper Thin Films
Kinji TAMAKAWA, Ken SUZUKI, Hideo MIURA
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Keywords: Thin Film, Residual Stress, Electroplated copper, Micro texture, Stress-induced Migration
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© 2013 The Japan Society of Mechanical Engineers
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