The Proceedings of the Materials and Mechanics Conference
Online ISSN : 2424-2845
2014
Session ID : OS0208
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OS0208 Clarification of Dominant Factors of Stress-Induced Migration in Electroplated Copper Thin-Film Interconnections
Ken SUZUKIMotoyuki OCHIHideo MIURA
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Abstract

In order to make clear the mechanism of the directional coarsening (rafting) of y' phases in Ni-base superalloys under uni-axial tensile strain, molecular dynamics (MD) analysis was applied to investigate dominant factors of strain-induced anisotropic diffusion of Al atoms. The diffusion constant of Al atoms was changed drastically by the dopant elements and their contents. When the lattice constant of the γ phase was increased and its melting point was decreased by the addition of Cr or Al atoms, the strain-induced anisotropic diffusion of Al atoms in the γ' phase was accelerated. On the other hand, the addition of Co decreased the diffusion significantly. Therefore, the changes of lattice constant and melting point depending on the chemical composition of the γ/γ' interface are the dominant factors controlling the strain-induced anisotropic diffusion of Al atoms in the Ni-base superalloy.

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© 2014 The Japan Society of Mechanical Engineers
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