Abstract
A cutting process of a semiconductor chip has a problem occurrence of heat and material loss. To solve these problems, the processing method which is used crack propagation has been proposed. The crack propagation simulator is needed for design the process condition. However, the he crack propagation prediction method which considered anisotropy of the fracture toughness value has not been established. In this paper, firstly, the crack propagation simulator for anisotropic material was developed and the validity of the calculation was compared with the experimental results.
