Measuring Thermal Strain of Micro Region on Electronic Packaging Using Digital Image Correlation

Abstract

In this research, a thermal strain on an electronic packaging is measured by digital image correlation with its periodical systematic error elimination method. To evaluate the strain at micro area, a microscopic lens and micro particles for the speckle pattern is used. Prior to the evaluation of the thermal strain on the electronic packaging, the thermal strain of a brazed bi-metal is measured. Results show that the strain distribution not affected with periodical error is evaluated. In addition, the strain distribution affected by mismatch of thermal expansion coefficients is observed around the boundary. However, it seems that some methods such as an introduction of other micro particles for the speckle pattern should be considered to enhance the displacement measurement accuracy.