Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 08, 2016 - October 10, 2016
This study provides that effects of interface edge geometrical condition on bonding strength of a ceramic to metal joint system with arc-shaped free surface. An electro-conductive ceramic silicon nitride (Si3N4) and the pure nickel (Ni) were used in this experiment. The interface edge shape was characterized by defining as a configuration angle between the interface plane surface and tangential line at the edge of the bonded interface of the joint system with arc-shaped free surface. The dependency of the bonding strength on the edge angle was experimentally clarified in the silicon nitride to nickel joint with arc-shaped free surfaces. The optimum interface edge angle appears at geometrical conditions which fracture pattern changes. It also shows that optimum geometrical conditions can improve bonding strength. This study contributes to provide useful geometric interface shapes to improve the tensile bonding strength of ceramic-to-metal joint.
