The Proceedings of the Materials and Mechanics Conference
Online ISSN : 2424-2845
2017
Session ID : OS0102
Conference information

Mixed Mode Fracture Behavior Analysis of Adhesives Joint by Digital Image Correlation
*Kento SHIMIZUMasaki OMIYASatoru YONEYAMA
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Abstract

This paper intends to develop the evaluation method for J-integral on adhesive joint. Recently, for weight reduction, different kinds of materials are used in automotive structures and conventional spot welding can not be applied to joining different kinds of materials. Adhesives are candidate for joining different kinds of materials, but it is necessary to ensure the reliability of adhesive joints under vibration, crash of automobile and so on. In this paper, evaluation method of J-integral for adhesive joints are developed. Displacements and strains around crack tip of adhesive joints were measured by Digital Image Correlation (DIC) method and J-integral were calculated for both Aluminum alloy (A5052) and adhesive joint. The results show that experimental result is roughly agree with theoretical estimation results.

Content from these authors
© 2017 The Japan Society of Mechanical Engineers
Previous article Next article
feedback
Top