The Proceedings of the Materials and Mechanics Conference
Online ISSN : 2424-2845
2017
Session ID : OS0806
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Consideration of Cold Sprayed Particle Deposition Mechanism by Surface Activated Bonding Technique
*Yudai TERUISakura TAGOYuji ICHIKAWAKazuhiro OGAWATakehito SHIMATSU
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Abstract

Cold spraying (CS) is a kind of deposition techniques that form a film by solid particle impingement onto the substrate at high velocity. This technique is considered that solid particles by CS, which are able to form coatings for removing native oxide film and forming active nascent surface by large plastic deformation at the time of impinging onto the substrate. On the other hand, surface activated bonding (SAB) is a bonding technique that it removes the oxide layer and form active nascent surface by using a fast atom beam (FAB) in a vacuum. There are a few similarities in bonding mechanism between CS and SAB. Conventional studies show that Al particles deposit on Fe substrate by CS, but Fe bulk did not bond Al bulk by SAB. The reason that both bulks do not bond by SAB is considered contact area of materials, but its detailed mechanism is not revealed yet. Therefore, the bonding of Fe foil and Al foil, and Fe bulk and Al bulk was carried out by SAB. Micro tensile tests in focused ion beam (FIB) equipment was used to measure the bonding strength. Micro tensile tests are able to measure the bonding strength of Fe foil and Al foil. The result showed that the bonding strength was proportional to contact pressure. In addition, the average roughness and Vickers hardness to confirm the deformation of foils and bulks were measured. These result suggested that foils and bulks did not deform. Consequently, it is suggested that it is important for SAB to increase contact area.

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© 2017 The Japan Society of Mechanical Engineers
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