Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 07, 2017 - October 09, 2017
This study provides that effects of interface edge shape on bonding strength of ceramics to metal joint system with arc-shaped free surfaces. Each joint specimen, Si3N4 to Ni joint which was composed of silicon nitride as electro-conductive ceramic and the pure nickel, was bonded at 980°C in a furnace maintained vacuum condition. Relationship between bonding tensile strength and the edge shape was clarified experimentally. These experimental results were compared with our past results using the Si3N4 to Ni specimens bonded at 780°C and 880°C. It was clarified temperature dependence of optimum interface edge shape which the maximum bonding strength appears range over 780°C≦T≦980°C.
