Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : December 22, 2018 - December 24, 2018
The purpose of this study is to clarify the effects of surface oxide layer on fracture toughness of approximately 500-nm-thick freestanding copper nano-films. Freestanding film specimens with thermal oxide layer (oxide layer thickness: ~3 nm and ~6 nm) were prepared by thermal treatment in dry air. Specimens without oxide layer were prepared by removing the surface oxide layer by means of argon ion sputtering. In situ field emission scanning electron microscope fracture toughness experiments confirmed that a crack initiated at the notch root by applying a tensile load. The effects of surface oxide layer on the critical crack tip opening displacement of the specimens with native/thermal oxide layer were not clearly observed. On the other hand, the critical crack tip opening displacement of the specimens without oxide layer was clearly higher than that of the specimens with native/thermal oxide layer.
