Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : September 15, 2021 - September 17, 2021
In recent years, adhesives have been applied not only in our daily lives but also in various fields such as automobiles, aviation, and electrical products. In addition, adhesives are expected to be used to join various mechanical parts for the purpose of weight reduction. Although a polymer adhesive such as epoxy resin or urethane resin has high bonding strength, it cannot be used in high temperature environments of 400°C or higher. Therefore, inorganic adhesives with excellent heat resistance are attracting attention for joining components that are exposed to high temperatures. However, inorganic adhesives become hard and brittle after heat curing, and their bonding strength cannot be improved by increasing adhesion area in overlap bonding. In this study, the bonding strength of the joint which are made of a stainless steel rod fitted into a stainless cylinder with an inorganic adhesive was evaluated analytically and experimentally. In this paper, we report the effect of the thermal stress on the joint strength which was investigated by stress analysis.
