The Proceedings of the Materials and Mechanics Conference
Online ISSN : 2424-2845
2021
Session ID : OS1411
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Finite element heat transfer analysis of the aluminum-composite solid state cooling device using latent heat storage effect of nickel titanium shape memory alloy
*Yuta NAITOHiroyuki KATO
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Abstract

Latent heat is the amount of heat absorbed or emitted when a phase change material (PCM) undergoes the change. Latent heat storage material shall use the latent heat as the heat sink for cooling down the temperature of other substance. This study proposed Nickel Titanium shape memory alloy as the latent heat storage material for the solid-state cooling device of heat source, such as CPU, for example. In order to deal with the latent heat in heat transfer analysis, the enthalpy curve during the martensitic transformation in the alloy was calculated from the DSC curve obtained in experiment. A finite element heat transfer analysis was conducted on a model composite material composed of Nickel Titanium wire and aluminum matrix. The heat conduction during the martensitic transformation was calculated. It was found that the rate of the rise in temperature decreases in proportion to the volume fraction of nickel titanium shape memory alloy.

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© 2021 The Japan Society of Mechanical Engineers
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