Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : November 25, 2025 - November 29, 2025
In recent years, application of phase change materials, PCMs to cooling of electronic devices has been attracted attention. Electronic devices are cooled by forced convection of air or water. However, small electronic devices such as mobile phones are cooled naturally because they do not have the space to install cooling devices. Mobile phones tend to generate heat due to their miniaturization and increased functionality, which can cause low- temperature burns to users and lead to thermal runaway of CPU. Therefore, there is a demand for compact cooling devices for mobile phones. In this study, composite sheets consisted of microencapsulated paraffin, MPCM and high density polyethylene are fabricated for cooling mobile devices. The sheets are fabricated by changing the mass fraction of MPCM and its melting point. MPCM with melting points of 25°C and 32°C are used. The cooling performance of the sheets is experimentally evaluated by heating and cooling test. Effects of mass fraction of MPCM and melting point on cooling performance of the sheets have been examined. The more PCM contained, the longer the time that temperature rise in the mobile phone is suppressed, on the other hand, which delays cooling of the sheet. It is found that the sheet using MPCM with a melting point of 32°C is more effective in suppressing the temperature rise of a mobile phone under the prescribed heating condition.
