The electronic part material grinding case of the super abrasive wheel

Abstract

The IT industry prospers with the development of the electric technique. The electric technique stands up in the high quality of the electronic part. The part manufacture is looking for the high precision and the low cost. New vitrified bond Wheel meets those requests. The good point can do low Grinding force and do continuation grinding in fine abrasive. In this paper, it introduces the grinding case of the silicon. Moreover, it reports the optimal design guide of the wheel.