Abstract
This report describes the development of the micro-ice jet machining (IJM) device for the via fabrication on the resin isolation film of semiconductors, which is capable of intermittent blasting of micro-ice. The IJM process is similar to an abrasive jet machining (AJM), and selectively removes softer materials than the micro ice of pure water. IJM uses fine ice powders, which are produced under the low temperature condition of -150℃ or below. As the ice jet stream from the nozzle is focused onto the workpiece, small holes or slots can be machined. The blasted micro-ice is melted and has no influence upon the environment of production processes. We investigated the blasting characteristics and the possibility of the IJM process. It was clear that the IJM device can blast micro-ice intermittently and that the resin material, which is softer than micro-ice, can be machined.
