The Proceedings of The Manufacturing & Machine Tool Conference
Online ISSN : 2424-3094
2002.4
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ELID Grinding of Si Wafer by Ultra-precision Rotary Grinder "RG-800"
Hiroaki ETOYu tang DAINoboru EBIZUKAToshikazu EBISUZAKIWei min LINHitoshi OHMORIAkitake MAKINOUCHI
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CONFERENCE PROCEEDINGS FREE ACCESS

Pages 31-32

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Abstract
ELID (Electrolytic In-process Dressing) grinding technique can achieve high-efficiency grinding, and ultra-precision mirror surface grinding has been able to obtain mirror surface finish easily for hard and brittle materials. We are developing a new ultra-precision mirror surface machining system with ELID. This machine is Ultra-precision Rotary Grinder "RG-800" that has a very large rotary table (size : φ800mm) and it can be controlled at a feeding resolution of 10nm. This paper introduces the concept of the developed ultra-precision rotary grinder with ELID, the specification, and trial of ELID-grinding of Si wafer. In the future, this technique can be applied to produce ultra lightweight mirrors of next generation space telescopes.
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© 2002 The Japan Society of Mechanical Engineers
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