Abstract
Surface plunge grinding of glass quartz is conducted with a SD270 metal-bonded diamond wheel, the cutting edges of which are truncated so as to be aligned with the height of the grinding wheel working surface, and the ground surface roughness is investigated in terms of the truncation depth and the workpiece speed. It is found that the ground surface roughness decreases with the increase of truncation depth and converges to a value depending on the workpiece speed. The ground surface roughness decreases with the workpiece speed, and the roughness of Ra 16nm was obtained at the truncation depth of 15μm and the workpiece speed of 0.6m/min. Furthermore, resin-bonded diamond grinding wheels of various mesh sizes are applied to the grinding of the glass quartz under the same grinding conditions, and it is found that the cutting-edge-truncated SD270 metal-bonded grinding wheel brings about the roughness better than that obtained from a SD3000 resin-bonded grinding wheel.
