Abstract
This study aims to clarify the interaction between Si wafer and individual diamond abrasives in grinding processes in an atomic level. This paper reports on the results obtained through the nano-scratching simulations by using the molecular dynamics method and the experiments by an atomic force microscope (AFM), respectively. In the experiments, the influence of environment, such as atmospheric pressure and temperature, were evaluated. From the experimental results, the formation of embossment on the scratched area was observed under air, while the formation of concave groove was observed under vacuum. It was also proven that the scratch groove under high temperature becomes deeper than that under room temperature in both the experiments and the simulations.
