Abstract
Electron element develops into high speed, high performance and high function, caused by the rapid development of the information technology. The wafer thickness of the electronic element becomes thin with performance. As that representative, the wafer becomes a big diameter, and moreover high precision, high quality and a low cost are demanded. It is difficult by the lapping of slurry to satisfy those requirements. A demand for the ultra-precision processing by grinding has been rising. We developed the fine diamond grains wheel of the new concept to. process Ultra-precision grinding. Therefore, it is reported about the Ultra-precision grinding that high precision is realized.
