Abstract
Used in the production of semiconductors and solar panels, the demand for silicon wafers is increasing. However, in the current state of manufacturing process, 50% from the cutting process goes to waste. To reduce processing waste and to cut the silicon wafer thinly, a new laser cutting method was developed. A YAG laser's beam slightly penetrates silicones. By using this property, cracks in a plane parallel to the inner surface of silicon wafers are made, cutting the wafer as a whole. In this paper, experimental laboratory equipment was made and from the basic experimental results, we would like to report the successful separation of the silicon wafer.
