B28 450mm大口径ウエハ研削盤の開発 : 切込機構内蔵砥石スピンドルの基本特性(OS2 最新機械要素技術(2))

岩橋 伸太郎; 本多 歩; 楠山 純平; 北嶋 孝之; 由井 明紀; 齋藤 浩嗣; A.H. Slocum

doi:10.1299/jsmemmt.2014.10.109

2014.10

Session ID : B28

DOI https://doi.org/10.1299/jsmemmt.2014.10.109

Conference information

B28 Development of Grinding Machine for 450mm Wafer : Fundamental Performance of Wheel Spindle which creates both rotary and axial feed motion

Shintaro IWAHASHI, Ayumu HONDA, Jumpei KUSUYAMA, Takayuki KITAJIMA, Akinori YUI, Hirotsugu SAITO, A.H. Slocum

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Keywords: 450mm Silicon wafer, Grinding spindle, Feed motion, Hydrostatic water bearing, Static stiffness

CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract

A high stiff rotary grinding machine for 450mm Si wafer has been designed and developed. In order to improve a stiffness of the machine, rotary and axial feed motion was built in a grinding spindle. As the result, we can reduce the number of component parts and successfully developed high stiffness grinding machine.

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