The Proceedings of The Manufacturing & Machine Tool Conference
Online ISSN : 2424-3094
2014.10
Session ID : B34
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B34 Investigation of Surrounding Condition in Micro-drilling for SiC by 4th Harmonics of YAG Laser
Kiichi AsakoYasuhiro OkamotoAkira Okada
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Abstract
Silicon carbide is expected as a material for power devices in the next generation. The superior processing technique is important in order to utilize the high performance of silicon carbide. The laser processing is useful method for micro-machining of silicon carbide. However, it is reported that the laser induced plasma has a great influence on machining characteristics. Therefore, the observation of the flow field around drilled hole and the debris behavior on silicon carbide by the 4th harmonic of Nd:YAG laser were experimentally investigated in the viewpoints of the surrounding gas pressure conditions. Moreover, the surface integrity of silicon carbide by the 4th harmonic of Nd:YAG laser was discussed by the observation of the plasma on the specimen surface.
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© 2014 The Japan Society of Mechanical Engineers
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