The automatic detection of the edge defect of the die

Abstract

Since chipping in the cutting edge of the film for the punching die significantly degrades the performance of the punching die, it is required to inspection at the micron level over the entire length of the cutting edge. In this study, we proposed the method for detecting by continuous scanning and the spatial frequency filtering for micro areas, it has been shown to have a detection performance at the micron level. In this paper, to build a measurement system by the simultaneous three-axis control for a punching die having a blade of linear shape and curvature shape, report the results of verifying its validity.