Abstract
Recently, manufacturing innovation have advanced all over the world by IoT and digital technology. Processing condition monitoring is attracting attention as an one of the most important technology. Research on processing monitoring has been conducted for many years. Various methods have also been proposed for monitoring of milling process. Semiconductor strain sensor is used in this study because it is inexpensive and highly sensitive. This paper aim to monitor of milling process using semiconductor strain sensor. In the first experiment, the strain of the clamping jig of the work material due to cutting force was measured by semiconductor strain sensor. In a second experiment, the strain on the thin part of the work material during micro end milling was measured by a sensor. The strain caused by periodically changing cutting force was successfully measured with high time resolution in each experiment.
