The Proceedings of The Manufacturing & Machine Tool Conference
Online ISSN : 2424-3094
2019.13
Session ID : A32
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Examination of drilling condition monitoring method by semiconductor strain sensor
*Hiroki OZAWAKatsuhiko SAKAIHiroo SHIZUKARyoji OKADAKentaro MIYAJIMA
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Abstract
Recently, data acquisition and utilization techniques in production site such as IOT and industry 4.0 have attracted attention. In the drilling process, in order to avoid the breakage of the tool and the decrease in the processing accuracy due to the progress of the tool wear, it is required to establish the monitoring technology of the processing state during the cutting process that can be used at the production site. From this, in this research, a semiconductor strain sensor developed for IOT applications was attached to the surface of the drill, and measured the strain generated in the drilling process by the cutting force in NC lathe and attempted to monitor the machining condition of the drill during machining. As a result, it was possible to detect the strain of the tool during drilling without reducing the rigidity of the tool using a strain sensor which is easy to install.
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© 2019 The Japan Society of Mechanical Engineers
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