MNM-3A-1 Fracture toughness of single- crystal-silicon thin film : temperature effect in low-temperature environment

Abstract

Fracture toughness of single crystal silicon was measured under low temperature ranging from -100℃ to room temperature. The thickness of the thin film specimen was only about 1 um. We developed the new measurement system with liquid nitrogen cooling chamber for conducting low temperature tests. The results showed the value of the fracture toughness decreased as the temperature decreased, especially varied widely between -20℃ to -50℃. Consequently, it would be concluded that the fracture mode changed around -20℃, as like brittle to ductile transition.