Abstract
Recently, measurement techniques for material properties of micro-joints with high spatial resolution are particularly required to improve the reliability of electronics devices. In this paper, we introduce the novel techniques to measure the material properties in micro scale region. Micro-thermoreflectance method which is able to measure the thermal conductivity of intermetallic, Nano-indentation technique(include nano-scratch test) which can evaluate the mechanical properties with nano-scale resolution. And, dynamic strain measurement technique for BGA package is exhibited using digital image correlation method during heating test at RT, 75 and 125℃.These are key measurement technologies for evaluation of the material properties to develop new micro electronics devices.
